Method of manufacturing module

ABSTRACT

A module  100  can be precisely manufactured by mounting an electronic component  102  and a terminal assembly  10  having a simple configuration, in which a plurality of connection terminals  11  are supported by a support body  12 , the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component  102  and the terminal assembly  10  mounted on the one principal surface of the wiring substrate  101 , with a first resin layer  103 . Also, since the plurality of connection terminals  11  are merely supported by the support body  12 , the support body  12  can be easily removed from the plurality of connection terminals  11 . Accordingly, the manufacturing time of the module  100  is decreased.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of manufacturing a moduleusing a plurality of connection terminals that form an interlayerconnection conductor, and also relates to a terminal assembly.

2. Description of the Related Art

As shown in an example module of the related art in FIG. 11, there hasbeen known a module 500, in which various types of electronic components502 are mounted on both surfaces of a wiring substrate 501, are sealedwith resin layers 503 (for example, see Patent Document 1). Also, ametal shield layer 504 is provided on one principal surface of themodule 500, and mounting terminals 505 for external connection areprovided on the other principal surface. The metal shield layer 504 andthe mounting terminals 505 are electrically connected with a wiringlayer of the wiring substrate 501 through via conductors 506 forinterlayer connection.

Each of the via conductors 506 is formed by forming a via hole in thecorresponding resin layer 503 provided on the wiring substrate 501 bylaser processing, applying desmearing to the via hole, and then fillingthe via hole with conductive paste containing, for example, Ag or Cu, orapplying via fill plating to the via hole. If the via hole is formed inthe resin layer 503 by laser processing as described above, theadjustment for the laser output may be troublesome, and hence theformation accuracy of the via hole may vary. Also, since the viaconductors 506 are formed in the resin layer 503 through the pluralityof steps, the manufacturing cost of the module may be increased, and themany steps may obstruct a decrease in the manufacturing time of themodule. Also, a chemical solution used when desmearing is applied to thevia holes formed in the resin layer 503 by laser processing or achemical solution when via fill plating is applied to the via holes mayerode the resin layer 503 and the wiring substrate 501.

Therefore, in recent years, as shown in FIG. 12, a terminal assembly600, in which a plurality of columnar connection terminals 601 that forman interlayer connection conductor are integrally formed with a couplingbody 602, is mounted on a wiring substrate 501 by a normal surface mounttechnology; and hence the interlayer connection conductor of a module isformed by the connection terminals 601 instead of the via conductors506. Thus, attempts are made to decrease the manufacturing cost of themodule and to decrease the manufacturing time of the module (forexample, see Patent Document 2). That is, the adjustment for the laseroutput, or the processing using the chemical solutions, such asdesmearing and plating, the processing which has been executed forformation of the via conductors 506 in the resin layer 503 through theplurality of steps including laser processing, is not required, and themodule including the interlayer connection conductor can be manufacturedby using a normal surface mount technology. FIG. 12 illustrates anexample terminal assembly of related art.

Patent Document 1: International Publication No. 2005/078796 (Paragraphs[0017]-[0025], and [0035], FIG. 1, Abstract, etc.)

Patent Document 2: Japanese Unexamined Patent Application PublicationNo. 2008-16729 (Paragraphs [0015]-[0017], FIG. 4, etc.)

BRIEF SUMMARY OF THE INVENTION

The terminal assembly 600 shown in FIG. 12 is manufactured by integrallyforming the plurality of columnar connection terminals 601 with thecoupling body 602, by etching, machining, or pressing a material made ofCu. In recent years, as the reduction in size of a communication mobileterminal, such as a cellular phone or a mobile information terminal,progresses, the reduction in size of a module that is mounted on thecommunication mobile terminal progresses. It is requested that aninterlayer connection conductor with a diameter in a range from severaltens of μm to several hundreds of μm is formed on the module. However,it is difficult to precisely integrally forming the plurality ofconnection terminals 601 with the coupling body 602 by machining orpressing with a processing accuracy in a range from several μm toseveral tens of μm.

If the connection terminals 601 are integrally formed with the couplingbody 602 by etching, the degree of progress of etching at base portionsof the connection terminals 601 differs from that at tip portions.Hence, the shapes of the connection terminals 601 may vary. Also, if theterminal assembly 600 is formed by etching or machining a material madeof Cu, the waste material after etching or machining may be thrown away.The waste is one of the reasons for increasing the manufacturing cost ofthe terminal assembly 600.

The terminal assembly 600 is mounted on the wiring substrate formed of,for example, a LTCC or a printed substrate, and then the coupling body602 of the terminal assembly 600 is removed from the connectionterminals 601. Hence, the interlayer connection conductor of the moduleis formed by the connection terminals 601. Since the connectionterminals 601 and the coupling body 602 are integrally formed, to removethe coupling body 602 from the terminal assembly 600 mounted on thewiring substrate, the coupling body 602 has to be removed by grinding.The removal is one of the reasons for increasing the manufacturing timeof the module.

The invention is made in light of the problems, and a first object is toprovide a technology that can precisely manufacture a module and candecrease the manufacturing time of the module, by using a terminalassembly having a simple configuration, in which a plurality ofconnection terminals that form an interlayer connection conductor aresupported by a support body, the configuration being highly precise,inexpensive, and new.

Also, a second object is to provide a terminal assembly having a simpleconfiguration, in which a plurality of connection terminals that form aninterlayer connection conductor are supported by a support body, theconfiguration being highly precise, inexpensive, and new.

To attain the above-described first object, a method of manufacturing amodule according to the invention includes a preparing step of preparinga terminal assembly, in which a plurality of columnar connectionterminals that form an interlayer connection conductor are supported bya support body; a first mounting step of mounting the terminal assemblyand an electronic component on one principal surface of a wiringsubstrate; and a first sealing step of sealing the electronic componentand the terminal assembly mounted on the one principal surface of thewiring substrate, with a first resin layer.

The support body of the terminal assembly on the one principal surfaceof the wiring substrate may be removed from the connection terminalsbefore the first sealing step.

One ends of the connection terminals may be supported by the supportbody by bond or adhesion, and the support body may be removed from theconnection terminals by decreasing a bond force or an adhesive force ofthe support body.

The method may further include a step of grinding a surface of the firstresin layer after the first sealing step.

The one ends of the connection terminals may be cut away in the grindingstep.

The method may further include a second mounting step of mounting anelectronic component on the other principal surface of the wiringsubstrate; and a second sealing step of sealing the electronic componentmounted on the other principal surface of the wiring substrate, with asecond resin layer.

The terminal assembly may be further mounted on the other principalsurface of the wiring substrate in the second mounting step, and thesupport body of the terminal assembly on the other principal surface ofthe wiring substrate may be removed from the connection terminals beforethe second sealing step.

An electronic component may be further mounted on the second resin layerformed in the second sealing step so that the electronic component isconnected with the connection terminals of the terminal assembly mountedon the other principal surface of the wiring substrate.

To attain the above-described second object, a terminal assemblyaccording to the invention is mounted on a wiring substrate included ina module, and in the terminal assembly, a plurality of columnarconnection terminals that form an interlayer connection conductor of themodule are supported by a support body.

The support body may be formed of a plate-shaped member having a bondlayer or an adhesive layer formed on one surface of the plate-shapedmember, and one ends of the connection terminals may be supported by thesupport body by bond or adhesion to the one surface of the plate-shapedmember.

According to an aspect of the invention, the terminal assembly, in whichthe plurality of columnar connection terminals that form the interlayerconnection conductor are supported by the support body, is prepared.Unlike the terminal assembly of the related art, the connectionterminals that are supported by the support body are formed separatelyfrom the support body. Accordingly, as compared with the connectionterminals of the related art which are integrally formed with thesupport body, since the connection terminals are formed separately fromthe support body, the terminal assembly prepared in the preparing stepis formed such that the plurality of columnar connection terminalshaving high processing accuracy and having extremely highly preciseshapes are supported by the support body.

Also, the terminal assembly has the simple configuration, in which theplurality of connection terminals are supported by the support body, andthere is no material which is etched or cut, and thrown away when theterminal assembly is prepared unlike the case of the related art.Accordingly, the cost for preparing the terminal assembly is decreased.Therefore, the module can be precisely manufactured by mounting theelectronic component and the terminal assembly having the simpleconfiguration, in which the plurality of connection terminals aresupported by the support body, the configuration being highly precise,inexpensive, and new, on the one principal surface of the wiringsubstrate; and by sealing the electronic component and the terminalassembly mounted on the one principal surface of the wiring substrate,with the first resin layer.

Also, the plurality of connection terminals are merely supported by thesupport body, and the connection terminals and the support body areformed separately from each other. As compared with the terminalassembly having the integrated structure of the related art, the supportbody can be easily removed from the plurality of connection terminals.Accordingly, the manufacturing time of the module can be decreased.

According to another aspect of the invention, the support body of theterminal assembly on the one principal surface of the wiring substrateis removed from the connection terminals before the first sealing step.Accordingly, the filling performance of the resin charged onto the oneprincipal surface of the wiring substrate for forming the first resinlayer is increased. Also, when the resin is charged onto the oneprincipal surface of the wiring substrate, the support body of theterminal assembly mounted on the one principal surface has been removed.Accordingly, the air easily escapes, and a void can be prevented frombeing generated in the first resin layer.

Also, since the support body of the terminal assembly mounted on the oneprincipal surface of the wiring substrate has been removed, resin in anyof various forms, such as liquid-state resin or a resin sheet, can beused for forming the first resin layer. The first resin layer can beeasily formed by any of generally known various methods.

According to another aspect of the invention, the one ends of theconnection terminals are supported by the support body by the adhesionor the pressure sensitive adhesion, and the support body can be easilyremoved from the connection terminals by decreasing the bond force orthe adhesive force of the support body, by heating etc.

According to another aspect of the invention, since the surface of thefirst resin layer is grinded after the first sealing step, the surfaceof the first resin layer can be flattened. Also, since the surface ofthe first resin layer is grinded, the height of the module to beprovided can be decreased.

According to another aspect of the invention, the one ends of theconnection terminals are cut away together with the surface of the firstresin layer in the grinding step. Accordingly, lands for externalconnection formed of the one ends of the connection terminals can beformed at the surface of the first resin layer.

According to another aspect of the invention, the electronic componentis mounted on the other principal surface of the wiring substrate, andthe electronic component mounted on the other principal surface of thewiring substrate is sealed with the second resin layer. Accordingly, themounting density of electronic components that are mounted on the modulecan be increased. This configuration is practical.

According to another aspect of the invention, the terminal assembly isfurther mounted on the other principal surface of the wiring substrate.Accordingly, an interlayer connection conductor provided by theconnection terminals can be formed in the second resin layer. Also, thesupport body of the terminal assembly on the other principal surface ofthe wiring substrate is removed from the connection terminals before theelectronic component and the terminal assembly mounted on the otherprincipal surface of the wiring substrate are sealed with the secondresin layer. Accordingly, the resin for forming the second resin layercan be efficiently charged onto the other principal surface of thewiring substrate.

According to another aspect of the invention, the electronic componentis further mounted on the second resin layer formed in the secondsealing step so that the electronic component is connected with theconnection terminals of the terminal assembly mounted on the otherprincipal surface of the wiring substrate. Accordingly, the mountingdensity of electronic components that are mounted on the module can befurther increased. This configuration is practical.

According to another aspect of the invention, the terminal assembly isformed such that the plurality of columnar connection terminals thatform the interlayer connection conductor are supported by the supportbody. Unlike the terminal assembly of the related art, the connectionterminals that are supported by the support body are formed separatelyfrom the support body. Accordingly, as compared with the connectionterminals of the related art which are integrally formed with thesupport body, since the connection terminals are formed separately fromthe support body, the plurality of columnar connection terminals havingextremely highly precise shapes are supported by the support body.

Also, the terminal assembly has the simple configuration, in which theplurality of connection terminals are supported by the support body, andthere is no material which is etched or cut, and thrown away when theterminal assembly is manufactured unlike the case of the related art.The manufacturing cost of the terminal assembly is decreased.Accordingly, the terminal assembly having the simple configuration, inwhich the plurality of connection terminals are supported by the supportbody, the configuration being highly precise, inexpensive, and new, canbe provided.

According to another aspect of the invention, the support body is formedof the plate-shaped member having the bond layer or the adhesive layerformed on the one surface of the plate-shaped member, and the one endsof the connection terminals are supported by the support body by theadhesion or the pressure sensitive adhesion to the one surface of theplate-shaped member. Accordingly, the terminal assembly with theextremely practical configuration can be provided.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a terminal assembly used for a module according to afirst embodiment of the invention.

FIG. 2 is a bottom view of the terminal assembly used for the moduleaccording to the first embodiment of the invention.

FIGS. 3(a)-(d) illustrate a method of manufacturing the module accordingto the first embodiment of the invention.

FIG. 4 illustrates a module according to a second embodiment of theinvention.

FIG. 5 illustrates a module according to a third embodiment of theinvention.

FIG. 6 illustrates a module according to a fourth embodiment of theinvention.

FIG. 7 illustrates a module according to a fifth embodiment of theinvention.

FIG. 8 provides enlarged views of primary portions of connectionterminals according to modifications.

FIG. 9 illustrates a module according to a modification.

FIGS. 10(a)-(b) illustrate a terminal assembly according to amodification.

FIG. 11 illustrates an example module of the related art.

FIG. 12 illustrates an example terminal assembly of the related art.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

A module according to a first embodiment of the invention is describedwith reference to FIGS. 1 to 3. FIG. 1 illustrates a terminal assemblyused for the module according to the first embodiment of the invention.FIG. 2 is a bottom view of the terminal assembly used for the moduleaccording to the first embodiment of the invention. FIG. 3 illustrates amanufacturing method of the module according to the first embodiment ofthe invention, FIG. 3(a) to FIG. 3(d) showing respectively differentsteps.

With a method of manufacturing the module described in this embodiment,a high-frequency circuit module that are to be mounted to the motherboards of the communication mobile terminals such as various types ofcommunication modules, such as a Bluetooth (registered trademark) moduleand a wireless LAN module; an antenna switch module; a power supplymodule are manufactured.

(Method of Manufacturing Terminal Assembly, and Terminal Assembly)

A terminal assembly 10 including a plurality of columnar connectionterminals 11 that form an interlayer connection conductor of a module100 shown in FIG. 3(d), and being mounted on a wiring substrate 101 ofthe module 100 is described. As shown in FIGS. 1 and 2, the terminalassembly 10 includes the columnar connection terminals 11 that form theinterlayer connection conductor of the module 100 when the connectionterminals 11 are mounted on the wiring substrate 101, and a plate-shapedsupport body 12. The plurality of connection terminals 11 are supportedat predetermined positions on one surface of the support body 12 with asupport layer 13 interposed therebetween.

Each of the connection terminals 11 may be a metal pin made of a metalconductor, such as Cu, an alloy, in which Fe is mixed into Cu by a ratioin a range from 0.1% to 20%, Au, Ag, or Al. Since the connectionterminal 11 is made of an alloy having a hardness that is increasedbecause Fe is mixed into Cu, a burr and the like can be prevented frombeing generated when the connection terminal 11 is cut. Hence,processing accuracy, for example, when the connection terminal 11 iscut, can be increased. Alternatively, a wire rod of a metal conductorhaving a desirable diameter and having a circular or a polygonalcross-sectional shape is sheared by a predetermined length. Hence, theconnection terminal 11 is formed in a shape of a cylindrical column or apolygonal column.

In this embodiment, the wire rod of the metal conductor is sheared, andthen the sheared portion is pressed in the axial direction of theconnection terminal 11. Hence, a flange-shaped protruding portion 11 ais formed at one end of the connection terminal 11.

With the protruding portion 11 a, the contact area between the supportlayer 13 and the one end of the connection terminal 11 is increased, andhence the one end of the connection terminal 11 can be reliablysupported by the support layer 13 by bond or adhesion. While theplate-shaped member forming the support body 12 may be made of anymaterial; however, for example, if the terminal assembly 10 is mountedon the wiring substrate 101 of the module 100 by soldering, the supportbody 12 is preferably formed of a plate-shaped member of a materialwhich is not deformed with heat during reflowing.

The support layer 13 of the support body 12 may be formed by applying aliquid-state bond or a liquid-state adhesive on one surface of theplate-shaped member, or by attaching a sheet-shaped bond sheet or asheet-shaped adhesive sheet on the one surface of the plate-shapedmember. The support layer 13 has a thickness being as small as possibleto prevent an error from being generated in heights of the connectionterminals 11 when the connection terminals 11 are mounted on the wiringsubstrate 101 of the module 100 and to prevent the connection terminals11 from being tilted. The support layer 13 is preferably formed by athickness of 100 μm or smaller, or more preferably 50 μm or smaller.

Also, the bond or the adhesive for forming the support layer 13 may bean epoxy based or acryl based adhesive. For example, the support layer13 may be formed of an adhesive having a characteristic that is softenedif being heated at a predetermined temperature or higher and hardened ifbeing cooled. If the support layer 13 is formed of the adhesive havingsuch a characteristic, in a state in which the terminal assembly 10 isstored, the support layer 13 of the support body 12 is hardened.Accordingly, dust and the like can be prevented from adhering to thesupport layer 13 of the support body 12 of the terminal assembly 10 instorage.

The terminal assembly 10 may be manufactured by any method; however, theterminal assembly 10 may be manufactured by, for example, inserting. Theterminal assembly 10 may be manufactured by inserting the connectionterminals 11 into respective transfer holes each having a largerdiameter than the diameter of each connection terminal 11 so that oneends of the connection terminals 11 protrude from the transfer holes;pressing the support body to the one ends of the connection terminals 11and causing the support body to support the connection terminals 11; andthen removing the support body from the insert jig.

As described above, terminal assemblies 10 may be manufactured forrespective corresponding modules 100. Alternatively, terminal assemblies10 may be manufactured by forming an assembly of a plurality of terminalassemblies 10 and then dividing the assembly into individual pieces ofterminal assemblies 10.

Also, the protruding portion may not be provided at one end of eachconnection terminal 11.

(Method of Manufacturing Module)

A method of manufacturing the module 100, in which the terminal assembly10 and electronic components 102 are mounted on the wiring substrate 101and sealed with resin, is described.

First, the terminal assembly 10, in which the plurality of columnarconnection terminals 11 that form the interlayer connection conductor ofthe module 100 are supported by the support body 12, is prepared (thepreparing step). Then, as shown in FIG. 3(a), the terminal assembly 10and the electronic components 102, such as various types of chipcomponents and ICs, are mounted at predetermined positions on the oneprincipal surface of the wiring substrate 101 by a typical surface mounttechnology, such as solder reflowing or supersonic vibration bonding(the first mounting step).

In this embodiment, the wiring substrate 101 is a multilayer ceramicsubstrate formed by laminating a plurality of ceramic green sheets andfiring the multilayer body. The ceramic green sheets are each a slurryin a sheet form in which mixed powder of alumina, glass, etc., is mixedwith an organic binder, a solvent, etc. Via holes are formed by laserprocessing or the like at predetermined positions of the ceramic greensheets, the formed via holes are filled with conductive paste containingAg, Cu, etc., and hence the via conductors for interlayer connection areformed. Various electrode patterns are formed by printing withconductive paste. Then, the ceramic green sheets are laminated andpress-bonded, and hence a ceramic multilayer body is formed. The ceramicmultilayer body is fired by low-temperature firing at a low temperaturearound about 1000° C. Thus, the wiring substrate 101 is formed.

The wiring substrate 101 includes various electrode patterns such as aninner wiring pattern, mounting electrodes on which the terminal assembly10 and the electronic components 102 are mounted, and externalconnection electrodes. The wiring substrate 101 may be formed of aprinted substrate using a resin or polymer material, a LTCC, an aluminabased substrate, a glass substrate, a composite material substrate, asingle-layer substrate, or a multilayer substrate. The wiring substrate101 may be formed by appropriately selecting an optimal material inaccordance with the intended use of the module 100.

Next, as shown in FIG. 3(b), the support body 12 of the terminalassembly 10 mounted on the one principal surface of the wiring substrate101 is removed from the connection terminals 11. In this embodiment, theprotruding portions 11 a formed at the respective one ends of theconnection terminals 11 are supported by the support layer 13 of thesupport body 12 by bond or adhesion. By decreasing a bond force or anadhesive force of the support layer 13 of the support body 12, thesupport body 12 is removed from the connection terminals 11.

For example, if the support layer 13 is formed of an epoxy basedthermosetting bond or adhesive, the bond force or the adhesive force ofthe support layer 13 may be decreased by heating the support layer 13 atits glass transition temperature (Tg) or higher, and the support body 12may be removed from the connection terminals 11. In this case, when heatis applied for decreasing the bond force or the adhesive force of thesupport layer 13, the glass transition temperature of the support layer13 is preferably about 200° C., which is a melting temperature of thesolder, or lower so that the solder for joining the terminal assembly 10and the electronic components 102 with the wiring substrate 101 is notmolten.

For example, if the support layer 13 is formed of an acryl based bond oradhesive, the bond force or the adhesive force of the support layer 13may be decreased by using an alkaline surface-active agent, ethylacetate, or the like, and the support body 12 may be removed from theconnection terminal 11.

Then, as shown in FIG. 3(c), resin is charged onto the one principalsurface of the wiring substrate 101, and hence the electronic components102 and the terminal assembly 10 mounted on the one principal surface ofthe wiring substrate 101 are sealed with the first resin layer 103 (thefirst sealing step). The first resin layer 103 may be formed of acomposite resin made by mixing an inorganic filler, such as aluminumoxide, silica (silicon dioxide), or titanium dioxide, to thermosettingresin, such as epoxy resin, phenol resin, or cyanate resin.

For example, if the first resin layer 103 is formed by using a resinsheet, which is formed by molding a composite resin on a PET film andsemi-hardening the resin, the resin sheet is covered on the wiringsubstrate 101 while spacers (dies) having a desirable thickness arearranged along the periphery, the resin sheet is pressed with heat sothat the thickness of the resin meets the thickness of the spacers, thenthe wiring substrate 101 is heated in an oven to harden the resin, andthus the first resin layer 103 with a desirable thickness can be formed.The first resin layer 103 may be formed by using a typical moldingtechnology for forming a resin layer, such as a potting technology withuse of liquid-state resin, a transfer molding technology, or acompression molding technology.

Then, as shown in FIG. 3(d), the surface of the first resin layer 103 isgrinded by a roller blade or the like. Hence, unnecessary resin isremoved, the surface of the first resin layer 103 is flattened, and theone ends of the connection terminals 11 are exposed (the grinding step).Accordingly, the module 100, in which terminals (lands) for externalconnection are formed by the one ends of the connection terminals 11exposed at the surface of the first resin layer 103, is completed.

If the heights of the connection terminals 11 from the wiring substrate101 vary in accordance with the thickness of the solder for connectingthe other ends of the connection terminals 11 with the wiring substrate101, the one ends of the connection terminals 11 may be cut awaytogether with the first resin layer 103, so that the heights of theconnection terminals 11 from the wiring substrate 101 can be aligned.Also, for example, Ni/Au plating may be applied to the one ends of theconnection terminals 11 exposed at the surface of the first resin layer103.

In this embodiment, when the surface of the first resin layer 103 isgrinded, the one ends of the connection terminals 11 are grindedtogether with the resin layer 103, and hence the entire protrudingportions 11 a formed at the one ends of the connection terminals 11 areremoved. If the entire protruding portions 11 a are removed, the crosssections of the connection terminals 11 are exposed at the first resinlayer 103, as terminals for external connection. Hence, the terminalsfor external connection provided at the surface of the first resin layer103 can have uniform areas.

In the first sealing step, if the first resin layer 103 is formed sothat the one ends of the connection terminals 11 are exposed, the stepof grinding the surface of the first resin layer 103 does not have to beexecuted.

Alternatively, the first resin layer 103 may be formed by charging theresin onto the one principal surface of the wiring substrate 101 whilethe support body 12 of the terminal assembly 10 is not removed from theconnection terminals 11. In this case, in the grinding step, the supportbody 12 of the terminal assembly 10 may be removed by grinding, togetherwith the first resin layer 103.

As described above, modules 100 may be individually manufactured.Alternatively, an assembly of a plurality of modules 100 may be formedand then the assembly may be divided into individual pieces of modules100. In this case, when the plurality of terminal assemblies 10 aremounted on an assembly of wiring substrates 101, the assembly of theterminal assemblies 10 before division may be mounted on the assembly ofthe wiring substrates 101. With this configuration, the mounting time ofthe terminal assemblies 10 onto the wiring substrate 101 can bedecreased, and hence the manufacturing time of the module 100 can bedecreased.

Alternatively, when the plurality of terminal assemblies 10 are mountedon the assembly of the wiring substrates 101, the plurality of terminalassemblies 10 after division may be individually mounted on respectivepositions corresponding to the individual modules 100 of the assembly ofthe wiring substrates 101. In this way, the terminal assembly 10 can bemounted on the wiring substrate 101 with high positioning accuracy, ascompared with that the assembly of the terminal assemblies 10 is mountedon the assembly of the wiring substrates 101.

As described above, in this embodiment, the terminal assembly 10, inwhich the plurality of columnar connection terminals 11 that form theinterlayer connection conductor are supported by the support body 12, isprepared. However, unlike the terminal assembly of the related art, inwhich the support body and the connection terminals are integrallyformed, the connection terminals 11 that are supported by the supportbody are formed separately from the support body 12. Accordingly, ascompared with the connection terminals of the related art which areintegrally formed with the support body, since the connection terminals11 are formed separately from the support body 12, the terminal assembly10 prepared in the preparing step is formed such that the plurality ofcolumnar connection terminals 11 having extremely highly precise shapesare supported by the support body 12.

Also, the terminal assembly 10 has the simple configuration, in whichthe plurality of connection terminals 11 are supported by the supportbody 12, and there is no material which is etched or cut, and thrownaway when the terminal assembly 10 is prepared unlike the case of therelated art. Accordingly, the cost for preparing the terminal assembly10 is decreased. Therefore, the module 100 can be precisely manufacturedby mounting the electronic component 102 and the terminal assembly 10having the simple configuration, in which the plurality of connectionterminals 11 are supported by the support body 12, the configurationbeing highly precise, inexpensive, and new, on the one principal surfaceof the wiring substrate, and by sealing the electronic component 102 andthe terminal assembly 10 mounted on the one principal surface of thewiring substrate 101 with the first resin layer 103.

Also, the plurality of connection terminals 11 are merely supported bythe support body 12, and the connection terminals 11 and the supportbody 12 are separately formed. Therefore, as compared with the terminalassembly with the integral structure of the related art, the supportbody 12 can be easily removed from the plurality of connection terminals11, and thus the interlayer connection conductor of the module 100 canbe formed of the connection terminals 11. Accordingly, the manufacturingtime of the module 100 can be decreased.

Also, the resin is charged onto the one principal surface of the wiringsubstrate 101 while the support body 12 of the terminal assembly 10 onthe one principal surface of the wiring substrate 101 is removed fromthe connection terminals 11. Accordingly, the filling performance of theresin charged onto the one principal surface of the wiring substrate 101for forming the first resin layer 103 is increased. Also, when the resinis charged onto the one principal surface of the wiring substrate 101,the support body 12 of the terminal assembly 10 mounted on the oneprincipal surface has been removed. Accordingly, the air easily escapes,and a void can be prevented from being generated in the first resinlayer 103.

Also, since the support body 12 of the terminal assembly 10 mounted onthe one principal surface of the wiring substrate 101 has been removed,resin in any of various forms, such as a liquid-state resin or a resinsheet, can be used for forming the first resin layer 103. The firstresin layer 103 can be easily formed by any of generally known variousmethods.

Also, the one ends of the connection terminals 11 are supported by thesupport body 12 by bond or adhesion, and the support body 12 can beeasily removed from the connection terminals 11 by decreasing a bondforce or an adhesive force of the support body 12.

Also, the surface of the first resin 103 can be flattened by grindingthe surface of the first resin layer 103 after the first sealing step.

Also, if the one ends of the connection terminals 11 are cut awaytogether with the surface of the first resin layer 103 in the grindingstep, the lands for external connection provided by the one ends of theconnection terminals 11 can be easily formed at the surface of the firstresin layer 103.

Also, the terminal assembly 10, in which the plurality of columnarconnection terminals 11 with extremely highly precise shapes aresupported by the support body 12, has the simple configuration, in whichthe plurality of connection terminals 11 are supported by the supportbody 12. At the same time, the configuration is highly precise andinexpensive. The one ends of the connection terminals 11 are supportedby the support body 12, which is formed of the plate-shaped member withthe support layer 13 of the bond layer or the adhesive layer formed onthe one surface. Accordingly, the terminal assembly 10 has a highlypractical configuration.

Second Embodiment

A module according to a second embodiment of the invention is describedwith reference to FIG. 4. FIG. 4 illustrates the module according to thesecond embodiment of the invention.

The module according to this embodiment differs from the above-describedfirst embodiment in that, as shown in FIG. 4, an electronic component102 is further mounted on the other principal surface of the wiringsubstrate 101 of a module 100 a (the second mounting step). While otherconfigurations are similar to the first embodiment, the same referencesigns are applied to the similar configurations, and the description ofthe configurations is omitted. In this embodiment, the protrudingportions are not provided at the respective one ends of the connectionterminals 11. The end surfaces of the connection terminals 11 form landsfor external connection of the module 100 a.

Since the electronic component 102 is mounted on the other principalsurface of the wiring substrate 101, the mounting density of electroniccomponents 102 that are mounted on the module 100 a can be increased.This configuration is practical.

Third Embodiment

A module according to a third embodiment of the invention is describedwith reference to FIG. 5. FIG. 5 illustrates the module according to thethird embodiment of the invention.

The module according to this embodiment differs from the above-describedsecond embodiment in that, as shown in FIG. 5, the electronic component102 mounted on the other principal surface of the wiring substrate 101of a module 100 b is sealed with a second resin layer 104 (the secondsealing step). While other configurations are similar to the first andsecond embodiments, the same reference signs are applied to the similarconfigurations, and the description of the configurations is omitted.

As described above, similarly to the above-described second embodiment,since the electronic component 102 is mounted on the other principalsurface of the wiring substrate 101 and the electronic component 102mounted on the other principal surface of the wiring substrate 101 issealed with the second resin layer 104, the mounting density ofelectronic components 102 that are mounted on the module 100 b can beincreased. This configuration is practical.

Fourth Embodiment

A module according to a fourth embodiment of the invention is describedwith reference to FIG. 6. FIG. 6 illustrates the module according to thefourth embodiment of the invention.

The module according to this embodiment differs from the above-describedthird embodiment in that, as shown in FIG. 6, a metal shield layer 105is provided on the second resin layer 104 provided on the otherprincipal surface of the wiring substrate 101 of a module 100 c. Whileother configurations are similar to the first to third embodiments, thesame reference signs are applied to the similar configurations, and thedescription of the configurations is omitted. The metal shield layer 105is preferably electrically connected with GND wiring provided at thewiring substrate 101.

With this configuration, since the metal shield layer 105 is provided onthe second resin layer 104, in particular, noise is prevented frompropagating from an outer side portion to the electronic component 102sealed with the second resin layer 104, and radiation of anelectromagnetic wave etc. from the electronic component 102 sealed withthe second resin layer 104 is prevented.

Fifth Embodiment

A module according to a fifth embodiment of the invention is describedwith reference to FIG. 7. FIG. 7 illustrates the module according to thefifth embodiment of the invention.

The module according to this embodiment differs from the thirdembodiment described with reference to FIG. 5 in that, as shown in FIG.7, the terminal assembly 10 is mounted on the other principal surface ofthe wiring substrate 101 of a module 100 d (the second mounting step),and hence an interlayer connection conductor by the connection terminals11 is provided in the second resin layer 104. Also, the second resinlayer 104 is formed by charging the resin after the support body 12 ofthe terminal assembly 10 mounted on the other principal surface of thewiring substrate 101 is removed from the connection terminals 11.

Also, in this embodiment, an electronic component 102 is further mountedon the second resin layer 104 so that the electronic component 102 isconnected with the interlayer connection conductor formed by theconnection terminals 11 provided in the second resin layer 104. Whileother configurations are similar to the first to fourth embodiments, thesame reference signs are applied to the similar configurations, and thedescription of the configurations is omitted.

With this configuration, the terminal assembly 10 is further mounted onthe other principal surface of the wiring substrate 101. Accordingly,the interlayer connection conductor by the connection terminals 11 canbe formed in the second resin layer 104. Also, the support body 12 ofthe terminal assembly 10 on the other principal surface of the wiringsubstrate 101 is removed from the connection terminals 11 before theelectronic component 102 and the terminal assembly 10 mounted on theother principal surface of the wiring substrate 101 are sealed with thesecond resin layer 104. Accordingly, the resin for forming the secondresin layer 104 can be efficiently charged onto the other principalsurface of the wiring substrate 101.

Also, the electronic component 102 is further mounted on the secondresin layer 104 formed in the second sealing step so that the electroniccomponent 102 is connected with the connection terminals 11 provided inthe second resin layer 104. Accordingly, the mounting density of theelectronic components 102 that are mounted on the module 100 d can befurther increased. This configuration is practical.

<Modifications of Connection Terminals>

Modifications of connection terminals are described with reference toFIG. 8. FIG. 8 provides enlarged views of the primary portions of theconnection terminals according to the respective modifications. FIG.8(a) to FIG. 8(d) show respectively different modifications. FIG. 8(a)to FIG. 8(d) are enlarged views of the respective primary portions. Thesame reference signs are applied to the configurations similar to thosein the first to fifth embodiments, and the description of theconfigurations is omitted.

In an example shown in FIG. 8(a), a mounting electrode 101 a is providedby substantially the same area as the cross-sectional area of theconnection terminal 11 on the one principal surface of the wiringsubstrate 101. The connection terminal 11 is mounted on the mountingelectrode 101 a while a joining material S such as solder extends to theoutside of the mounting electrode 101 a. With this configuration, thejoining material S extending to the outside of the mounting electrode101 a is hooked to the first resin layer 103. Hence, the connectionterminal 11 is prevented from being removed from the first resin layer103. The joining material S such as solder may be also arranged betweenthe connection terminal 11 and the mounting electrode 101 a.

In an example shown in FIG. 8(b), a mounting electrode 101 b with alarger area than the cross-sectional area of the connection terminal 11is provided on the one principal surface of the wiring substrate 101.The connection terminal 11 is mounted on the mounting electrode 101 b bythe joining material S such as solder. With this configuration, thejoining material S extends to the entire mounting electrode 101 b withthe larger area than the cross-sectional area of the connection terminal11, and the joining material S extending to the entire mountingelectrode 101 b is hooked to the first resin layer 103. Accordingly, theconnection terminal 11 can be prevented from being removed from thefirst resin layer 103. The joining material S such as solder may be alsoarranged between the connection terminal 11 and the mounting electrode101 b.

In an example shown in FIG. 8(c), a connection terminal 11 b has atapered shape. Also, the mounting electrode 101 b with a larger areathan the cross-sectional area at the large-diameter side of theconnection terminal 11 b is provided on the one principal surface of thewiring substrate 101. The large-diameter side of the connection terminal11 b is mounted on the mounting electrode 101 b by the joining materialS such as solder. With this configuration, the connection terminal 11 bis wedged into the first resin layer 103. Hence, a large-diameterportion of the connection terminal 11 b is hooked to the first resinlayer 103, and the joining material S extending to the entire mountingelectrode 101 b with the larger area than the cross-sectional area atthe large-diameter side of the connection terminal 11 b is hooked to theresin layer 103. Accordingly, the connection terminal 11 b is preventedfrom being removed from the resin layer 103. The joining material S suchas solder may be also arranged between the connection terminal 11 b andthe mounting electrode 101 b. The area of the mounting electrode 101 bmay be equivalent to the cross-sectional area at the large-diameter sideof the connection terminal 11 b.

In an example shown in FIG. 8(d), the connection terminal 11 b has atapered shape. Also, the mounting electrode 101 b with a larger areathan the cross-sectional area at the small-diameter side of theconnection terminal 11 b is provided on the one principal surface of thewiring substrate 101. The small-diameter side of the connection terminal11 is mounted on the mounting electrode 101 b by the joining material Ssuch as solder. With this configuration, the joining material Sextending to the entire mounting electrode 101 b with the larger areathan the cross-sectional area at the small-diameter side of theconnection terminal 11 b is hooked to the resin layer 103. Accordingly,the connection terminal 11 b is prevented from being removed from theresin layer 103. The joining material S such as solder may be alsoarranged between the connection terminal 11 b and the mounting electrode101 b.

<Modification of Module>

Like a module according to a modification shown in FIG. 9, a land forexternal connection with a larger area than the cross-sectional area ofa connection terminal 11 may be formed by a protruding portion 11 a, atthe same surface as the surface of the first resin layer 103, by partlygrinding the protruding portion 11 a together with the first resin layer103 in the grinding step. With this configuration, since the land forexternal connection with the large area can be provided at the module100, the electrical connectivity of the module 100 when the module 100is mounted on a mother board etc. of a communication mobile terminal canbe increased. In this case, since the land for external connection (theprotruding portion 11 a) exposed at the surface of the first resin layer103 and the connection terminal 11 are integrally formed, as comparedwith a case in which a land is formed at the connection terminal 11exposed at the surface of the first resin layer 103 by screen printingor photolithography, the connection strength between the land (theprotruding portion 11 a) and the connection terminal 11 can beincreased.

Also, the protruding portion 11 a formed at the one end of theconnection terminal 11 can form the land with a large area at thesurface of the first resin layer 103. Since the land for externalconnection with an area required for connecting the module 100 with themother board etc. is formed at the surface of the first resin layer 103by the protruding portion 11 a, the diameter of the connection terminal11 can be smaller than the area of the land for external connection (theprotruding portion 11 a).

In this case, even if the connection terminals 11 are closely arrangedin the module 100 so that the lands formed at the surface of the firstresin layer 103 by the protruding portions 11 a of the respectiveconnection terminals 11 are closely arranged, various types ofelectronic components 102 can be arranged among the connection terminals11 and mounted on the wiring substrate 101 so that the electroniccomponents 102 are aligned with the flange-shaped protruding portions 11a of the respective connection terminals 11 in top view. Accordingly,the size of the module 100 can be decreased.

<Modification of Terminal Assembly>

A modification of a terminal assembly is described with reference toFIG. 10. For configurations similar to the first to fifth embodiments,the same reference signs are applied to the similar configurations, andthe description of the configurations is omitted.

A terminal assembly 10 a shown in FIG. 10(b) is formed by preparing asupport body 12 a having holes 12 a 1 made in a grid form in a resinplate at equivalent intervals for allowing the connection terminals 11to be inserted as shown in FIG. 10(a), and inserting the columnarconnection terminals 11 to the holes 12 a 1 at positions required forthe design form of a module from among the plurality of holes 12 alformed in the support body 12 a as shown in FIG. 10(b).

With this configuration, the terminal assembly 10 a can be easilymanufactured with a low cost merely by inserting the columnar connectionterminals 11 into the holes 12 al made in the plate-shaped support body12 a. Also, by inserting the connection terminals 11 into the requiredholes 12 al from among the plurality of holes 12 a 1 formed in thesupport body 12 a, the terminal assembly 10 a corresponding to the typeof module can be formed. Hence, it is not required to design the supportbody 12 a for each type of module. The manufacturing cost of theterminal assembly 10 a can be decreased.

Alternatively, the support body 12 a may be formed by forming holes 12al only at positions required for a resin plate in accordance with thedesign form of the module. Also, the support body 12 a may be formed byinjection molding with use of resin, or by making holes in a resinplate.

The invention is not limited to the above-described embodiments, andvarious modifications may be made other than those described abovewithin the scope of the invention. For example, in any of theabove-described embodiments, the support layer 13 is provided on thesupport body 12 of the terminal assembly 10, and then the connectionterminals 11, 11 b are supported. However, the support body 12 may beformed of a plate-shaped member of a magnetic material, instead of theprovision of the support layer 13 on the support body 12. With thisconfiguration, the one ends of the connection terminals 11 can beattracted by the magnetic force of the plate-shaped member, and hencethe connection terminal 11 can be supported by the support body 12.Also, the support body 12 can be easily removed from the connectionterminals 11, 11 b after the terminal assembly 10 is mounted on thewiring substrate 101.

The present invention can be widely applied to technologies of formingan interlayer connection conductor of a module, by mounting columnarconnection terminals on a wiring substrate of the module by using asurface mount technology. By mounting various types of electroniccomponents on the wiring substrate, a module having any of variousfunctions can be formed.

-   -   10 terminal assembly    -   11, 11 b connection terminal    -   11 a protruding portion    -   12 support body    -   13 support layer (bond layer, support layer)    -   100, 100 a, 100 b, 100 c, 100 d module    -   101 wiring substrate    -   102 electronic component    -   103 first resin layer    -   104 second resin layer

The invention claimed is:
 1. A method of manufacturing a module,comprising: a providing step of providing a terminal assembly comprisinga support body and a plurality of columnar connection terminals formingan interlayer connection conductor and supported by the support body; afirst mounting step of mounting the terminal assembly and one or moreelectronic components on one principal surface of a wiring substrate;and a first sealing step of sealing the electronic components and theterminal assembly mounted on the one principal surface of the wiringsubstrate, with a first resin layer, wherein the support body of theterminal assembly on the one principal surface of the wiring substrateis removed from the connection terminals after the first mounting stepand before the first sealing step.
 2. The method of manufacturing themodule according to claim 1, wherein one end of each of the connectionterminals is supported by the support body by bond or adhesion, and thesupport body is removed from the connection terminals by decreasing aforce of the bond or the adhesive of the support body.
 3. The method ofmanufacturing the module according to claim 2, further comprising a stepof grinding a surface of the first resin layer after the first sealingstep.
 4. The method of manufacturing the module according to claim 1,further comprising a step of grinding a surface of the first resin layerafter the first sealing step.
 5. The method of manufacturing the moduleaccording to claim 4, wherein the one end of each of the connectionterminals is shaved in the grinding step.
 6. The method of manufacturingthe module according to claim 1, further comprising: a second mountingstep of mounting one or more electronic components on another principalsurface of the wiring substrate; and a second sealing step of sealingthe electronic components mounted on the another principal surface ofthe wiring substrate, with a second resin layer.
 7. The method ofmanufacturing the module according to claim 6, wherein the terminalassembly is further mounted on the another principal surface of thewiring substrate in the second mounting step, and wherein the supportbody of the terminal assembly on the another principal surface of thewiring substrate is removed from the connection terminals before thesecond sealing step.
 8. The method of manufacturing the module accordingto claim 7, wherein one or more electronic components are furthermounted on the second resin layer formed in the second sealing step soas to be connected with the connection terminals of the terminalassembly mounted on the other principal surface of the wiring substrate.9. The method of manufacturing the module according to claim 1, furthercomprising a step of grinding a surface of the first resin layer afterthe first sealing step.